Indistrial Fanless PC LG-PR3100F, Intel 13/12th, Intel i9/i7, 2 DP, DVI, HDMI, 2.5GigE LAN, 9V-50V, Wide Temp, -40°C to 75°C, ignition optn.

Overview

Indistrial Fanless PC LG-PX3100F, Intel 13/12th, Intel i9/i7/i5/i3, 2 DP, DVI, HDMI, 2.5GigE LAN, 9V-50V, Wide Temp, -40°C to 75°C, ignition option.

Powered by 13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor (Raptor Lake/Alder Lake) with Intel® R680E Chipset, fanless -40°C to 75°C operating temperature, multiple 10G LAN/2.5G LAN/GigE LAN/SIM socket configuration, max 6 USB 3.2 Gen 2 connections supporting up to 10Gbps data rate, outstanding system performance, 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS mobile availability, 9V to 50V power input. Software ignition power control and rugged reliability in harsh environments, all-in-one integrated features, LOGISYS LG-PR3100F Series Fanless Embedded System is your new generation choices for Machine Vision, In-vehicle Computing, Public Security, Factory Automation, Intelligent Transportation System (ITS), Robotic Control, AMR/AGV, Deep Learning, and any Edge AI applications.

 Features

• Workstation-grade Platform : 13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
• Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture, with max 94% graphics performance and 181% GPU image classification inference performance enhanced
• 8 Independent 2.5G LAN with 4 IEEE 802.3at PoE+
• 4 Front-access M.2 SSD Tray, 6 USB 3.2 Gen 2
• DC 9V to 50V Power Input, Software Ignition Control
• Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0
• Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications

Feature Highlights

Outstanding Performance 

• The 13th/12th Gen Intel Core i9/i7/i5/i3 processor running with Intel R680E Chipset (former codename : Raptor Lake-S/Alder Lake-S), up to 65W TDP CPU supported
• New performance hybrid architecture supports up to 1.36x faster single-thread performance and up to 1.35x faster multi thread performance vs. 10th Gen Intel Core processors
• Intel UHD Graphics 770 driven by Intel Xe Architecture with up to 32 graphics execution units (EUs) to support AI workload parallelization, delivering up to 1.94x faster graphics performance and up to 2.81x faster in GPU image classification inference compared to 10th Gen Intel Core processors   
• High-speed data transfer : PCIe 4.0 (16GT/s), USB 3.2 Gen 2 (10G), 10GigE LAN (10G), SATA III (6G), 2.5GigE LAN (2.5G), GigE LAN (1G) 

Leading Integration

• Max 9 GigE LAN with 4 IEEE 802.3at 2.5G PoE+ (25.5W/48V) 
• 6 10G USB 3.2 Gen 2, 4 COM RS-232/422/485, 2 SIM Socket, 16 Isolated DIO, SUMIT A, B   
• Dual external 2.5” SSD trays, optional supports 4 front-access M.2 SSD trays
• Compact Configurations : M.2 Key B, M.2 Key E, M.2 Key M
• Wireless Connections : 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS
• Multiple displays : Dual DisplayPort, DVI-I and HDMI four independent 4K displays or one 8K display
• Versatile Ethernet Offerings : 10G LAN/2.5G PoE+/2.5G LAN/GigE LAN 
• Intel Deep Learning Boost (Intel DL Boost) and Intel Distribution of OpenVINO toolkit for AI Computing  

Rugged Reliability

• Fanless -40°C to 75°C operation
• ECC Memory supported   
• Always-on wireless communication supports seamless data delivery   
• Optional SUMIT A and SUMIT B support versatile scalability
• DC 9V to 50V Wide Range Power Input
• Ignition Power Control for in-vehicle applications
• EN50155 & EN50121-3-2
• Anti-shock, Anti-vibration

Optimized Manageability

• User-friendly chassis design supports easier system maintenance 
• Considerate Toolless SIM Card sockets and RTC Battery Socket Cover   
• Front-access & lockable SSD trays, RAID 0, 1 data protection
• Software Ignition Power Control, Remote Power Switch
• Real-time capable with Intel Time Coordinated Computing (Intel TCC) and support for Time-Sensitive Networking (TSN)
• Smart System Management : vPro, TPM 2.0, PXE, Wake on LAN, Watchdog Timer

Specifications