Indistrial Fanless PC LG-PR3100F, Intel 13/12th, Intel i9/i7, 2 DP, DVI, HDMI, 2.5GigE LAN, 9V-50V, Wide Temp, -40°C to 75°C, ignition optn.

  • Model: LG-PR3100F
  • Manufactured by: LOGISYS

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Starting at: $2,190.00

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Overview

Indistrial Fanless PC LG-PX3100F, Intel 13/12th, Intel i9/i7/i5/i3, 2 DP, DVI, HDMI, 2.5GigE LAN, 9V-50V, Wide Temp, -40°C to 75°C, ignition option.

Powered by 13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor (Raptor Lake/Alder Lake) with Intel® R680E Chipset, fanless -40°C to 75°C operating temperature, multiple 10G LAN/2.5G LAN/GigE LAN/SIM socket configuration, max 6 USB 3.2 Gen 2 connections supporting up to 10Gbps data rate, outstanding system performance, 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS mobile availability, 9V to 50V power input. Software ignition power control and rugged reliability in harsh environments, all-in-one integrated features, LOGISYS LG-PR3100F Series Fanless Embedded System is your new generation choices for Machine Vision, In-vehicle Computing, Public Security, Factory Automation, Intelligent Transportation System (ITS), Robotic Control, AMR/AGV, Deep Learning, and any Edge AI applications.

 Features

  • Workstation-grade Platform : 13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
  • Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture, with max 94% graphics performance and 181% GPU image classification inference performance enhanced
  • 8 Independent 2.5G LAN with 4 IEEE 802.3at PoE+
  • 4 Front-access M.2 SSD Tray, 6 USB 3.2 Gen 2
  • DC 9V to 50V Power Input, Software Ignition Control
  • Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0
  • Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications

Feature Highlights

Outstanding Performance 

  • The 13th/12th Gen Intel Core i9/i7/i5/i3 processor running with Intel R680E Chipset (former codename : Raptor Lake-S/Alder Lake-S), up to 65W TDP CPU supported
  • New performance hybrid architecture supports up to 1.36x faster single-thread performance and up to 1.35x faster multi thread performance vs. 10th Gen Intel Core processors
  • Intel UHD Graphics 770 driven by Intel Xe Architecture with up to 32 graphics execution units (EUs) to support AI workload parallelization, delivering up to 1.94x faster graphics performance and up to 2.81x faster in GPU image classification inference compared to 10th Gen Intel Core processors   
  • High-speed data transfer : PCIe 4.0 (16GT/s), USB 3.2 Gen 2 (10G), 10GigE LAN (10G), SATA III (6G), 2.5GigE LAN (2.5G), GigE LAN (1G) 

Leading Integration

  • Max 9 GigE LAN with 4 IEEE 802.3at 2.5G PoE+ (25.5W/48V) 
  • 6 10G USB 3.2 Gen 2, 4 COM RS-232/422/485, 2 SIM Socket, 16 Isolated DIO, SUMIT A, B   
  • Dual external 2.5” SSD trays, optional supports 4 front-access M.2 SSD trays
  • Compact Configurations : M.2 Key B, M.2 Key E, M.2 Key M
  • Wireless Connections : 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS
  • Multiple displays : Dual DisplayPort, DVI-I and HDMI four independent 4K displays or one 8K display
  • Versatile Ethernet Offerings : 10G LAN/2.5G PoE+/2.5G LAN/GigE LAN 
  • Intel Deep Learning Boost (Intel DL Boost) and Intel Distribution of OpenVINO toolkit for AI Computing  

Rugged Reliability

  • Fanless -40°C to 75°C operation
  • ECC Memory supported   
  • Always-on wireless communication supports seamless data delivery   
  • Optional SUMIT A and SUMIT B support versatile scalability
  • DC 9V to 50V Wide Range Power Input
  • Ignition Power Control for in-vehicle applications
  • EN50155 & EN50121-3-2
  • Anti-shock, Anti-vibration

Optimized Manageability

  • User-friendly chassis design supports easier system maintenance 
  • Considerate Toolless SIM Card sockets and RTC Battery Socket Cover   
  • Front-access & lockable SSD trays, RAID 0, 1 data protection
  • Software Ignition Power Control, Remote Power Switch
  • Real-time capable with Intel Time Coordinated Computing (Intel TCC) and support for Time-Sensitive Networking (TSN)
  • Smart System Management : vPro, TPM 2.0, PXE, Wake on LAN, Watchdog Timer

 

Specifications

System
Processor -24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
-16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
Chipset Intel® R680E
BIOS AMI
SIO IT8786E
Memory 2 DDR4 3200MHz SO-DIMM, up to 64GB 
OS Windows 10, 11, Linux
I/O Interface
Serial  Up to 4 COM RS-232/422/485
USB 6 USB 3.2 Gen 2
Isolated DIO 16 Isolated DIO : 8 DI, 8 DO (Optional)
LED Power, HDD, PoE, Wireless
SIM Card  2 External SIM Card Sockets
RTC Battery Front-access RTC Battery
Expansion
Mini PCIe 1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA
M.2

- 1 M.2 Key B Socket (3042/3052, SATA/USB 3(Default)/USB 2)

- 1 M.2 Key E Socket (2230, PCIe x2/USB)

SUMIT A, B 2 SUMIT Slot (Optional)
Graphics
Graphics Processor Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture
Interface

4 independent displays :
- 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz

- 1 DVI-I : Up to 1920 x 1080 @60Hz

- 1 HDMI : Up to 1920×1080 @ 60Hz

Storage
SATA 2 SATA III (6Gbps) support S/W RAID 0, 1
mSATA 1 SATA III (Mini PCIe Type, 6Gbps)
M.2 1 M.2 Key M Socket (2280, PCIe x4)
Storage Device

- Front-access 2.5" SSD/HDD Tray

- 4 Front-access M.2 Key M SSD Tray (LG-PR3100F-POE)

Audio
Audio Codec Realtek® ALC888S-VD, 7.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN
LAN 2 Intel® I226 2.5GigE LAN supports TSN
2.5G PoE
LAN 3 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
LAN 4 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
LAN 5 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
LAN 6 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
 *Remind : When enabled turbo mode, PoE power budget supports up to 25.5W/each, total 30W.
2.5G Ethernet (LG-PR3125F)
LAN 7  Intel® I225 2.5GigE LAN
LAN 8 Intel® I225 2.5GigE LAN
LAN 9 Intel® I225 2.5GigE LAN
10G Ethernet (LG-PR3171F)
LAN 7  Intel® X710-AT2 10GigE LAN
LAN 8 Intel® X710-AT2 10GigE LAN
Power
Power Input DC 9V to 50V
Power Interface

- 3-pin Terminal Block : V+, V-, Frame Ground

- 4-pin Mini-DIN 

Ignition Control 16-mode Software Ignition Control
Remote Switch 3-pin Terminal Block 
Others
TPM Infineon SLB9670 supports TPM 2.0, SPI Interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Mgmt. Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension 260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb)
Mounting

- Wallmount by mounting bracket

- DIN Rail Mount (Optional)

- 2U Rackmount (Optional)

Environment
Operating Temperature

35W TDP CPU :

-40°C to 75°C (-40°F to 167°F), Fanless

65W TDP CPU :

-40°C to 55°C (-40°F to 131°F), Fanless

LG-PR3125F : 

-40°C to 70°C (-40°F to 158°F), Fanless

LG-PR3171F : 

-25°C to 50°C (-13°F to 122°F), with Internal Fan

LG-PR3100F-POE : -40°C to 55°C (-40°F to 131°F), Fanless

Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% @75°C
Shock

- IEC 60068-2-27

- SSD : 50G @wallmount, Half-sine, 11ms

Vibration

- IEC 60068-2-64

- SSD : 5Grms, 5Hz to 500Hz, 3 Axis

EMC CE, FCC, EN50155, EN50121-3-2
Copyright by Logisysus