Mini Fanless LG-PR3100AI, Intel Hailo-8™ AI, 13/12th, i9/i7, 5x2.5G LAN, 4x POE, Wide Temp, -40°C to 65°C-

  • Model: LG-PR3100AI
  • Manufactured by: LOGISYS

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Starting at: $2,450.00

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Overview

LG-PR3100AI is powered by the latest 13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor that runs with Intel® R680E PCH and features the compact Hailo-8™ AI accelerator module supporting up to 26 TOPS with best-in-class power efficiency of 3 TOPS/W. The LG-PR3100AI provides breakthrough performance and AI inference capabilities at the edge. It supports multiple LAN configurations, including 2.5G, 2.5G PoE+, and GigE LAN and is packed full of interfaces, including 4 COM, 6 USB, 16 Isolated DIO, and 2 SIM card sockets. The high-performance high scalable design makes LF-PR3100AI an excellent AIoT solution for Traffic Vision, Real-time AOI, In-vehicle Computing, Public Security, Factory Automation, Intelligent Transportation, Deep Learning and any Edge AI applications.

Features

  • Workstation-grade Platform : 13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
  • Intel® UHD Graphics 770 driven by Intel® Xe Architecture, with max 94% graphics performance and 181% GPU image classification inference performance enhanced
  • Compact Hailo-8™ AI Accelerator supports up to 26 Tera-Operations Per Second (TOPS) with best-in-class power efficiency of 3 TOPS/W
  • 5 Independent 2.5G LAN with 4 IEEE 802.3at PoE+
  • 4 Front-access M.2 SSD Tray, 6 USB 3.2 Gen 2
  • DC 9V to 50V Power Input, Software Ignition Control
  • Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0
  • Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications

 

Specifications

System
Processor -24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
-16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
Chipset Intel® R680E
BIOS AMI
SIO IT8786E
Memory 2 DDR4 3200MHz SO-DIMM, up to 64GB 
OS Windows 10, 11, Linux
AI Accelerator
Processor Hailo-8™ AI Processor, up to 26 TOPS
Framework TensorFlow, ONNX
I/O Interface
Serial  Up to 4 COM RS-232/422/485
USB 6 USB 3.2 Gen 2
Isolated DIO 16 Isolated DIO : 8 DI, 8 DO (Optional)
LED Power, HDD, PoE, Wireless
SIM Card  2 External SIM Card Sockets
RTC Battery Front-access RTC Battery
Expansion
Mini PCIe 1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA
M.2

- 1 M.2 Key B Socket (3042/3052, SATA/USB 3(Default)/USB 2)

- 1 M.2 Key E Socket (2230, PCIe x2/USB)

SUMIT A, B 2 SUMIT Slot (Optional)
Graphics
Graphics Processor Intel® UHD Graphics 770 driven by Intel® Xe Architecture
Interface

4 independent displays :
- 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz

- 1 DVI-I : Up to 1920 x 1080 @60Hz

- 1 HDMI : Up to 1920×1080 @ 60Hz

Storage
SATA 2 SATA III (6Gbps) support S/W RAID 0, 1
mSATA 1 SATA III (Mini PCIe Type, 6Gbps)
Storage Device

- Front-access 2.5" SSD/HDD Tray

- 4 Front-access M.2 Key M SSD Tray (LG-PR3000PoE AI)

Audio
Audio Codec Realtek® ALC888S-VD, 7.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN
LAN 2 Intel® I226 2.5GigE LAN supports TSN
2.5G PoE
LAN 3 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
LAN 4 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
LAN 5 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
LAN 6 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
Power
Power Input DC 9V to 50V
Power Interface

- 3-pin Terminal Block : V+, V-, Frame Ground

- 4-pin Mini-DIN 

Ignition Control 16-mode Software Ignition Control
Remote Switch 3-pin Terminal Block 
Others
TPM Infineon SLB9670 supports TPM 2.0, SPI Interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Mgmt. Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension 260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb)
Mounting

- Wallmount by mounting bracket

- DIN Rail Mount (Optional)

- 2U Rackmount (Optional)

Environment
Operating Temperature

35W TDP CPU :

-40°C to 65°C (-40°F to 149°F), Fanless

65W TDP CPU :

-40°C to 45°C (-40°F to 113°F), Fanless

LG-PR3100PoE AI : -40°C to 45°C (-40°F to 113°F), Fanless

Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% @65°C
Shock

- IEC 60068-2-27

- SSD : 50G @wallmount, Half-sine, 11ms

Vibration

- IEC 60068-2-64

- SSD : 5Grms, 5Hz to 500Hz, 3 Axis

EMC CE, FCC, EN50155, EN50121-3-2

 

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